We can provide customized service for a variety of storage products
Master Control Chip Matrix
Covering the world's leading brands and mature and stable solutions, accurately matching different application scenarios (high-performance computing, large-capacity storage, home entertainment, game console performance enhancement, mobile storage, etc.).
Full Spectrum of NAND Flash Memory
Flexible selection of various levels of particles and 2D/3D NAND technology to balance performance, life, capacity and cost to meet diversified needs.
Collaborative Optimization Design
Not just hardware stacking, we focus on deep tuning of master control algorithms and NAND characteristics to ensure perfect coordination of firmware, FTL, error correction mechanism and specific NAND to maximize the overall performance and durability of SSD.
Multi-Scenario Solutions
whether it is to create an ultra-fast office notebook, an immersive game console, a portable and efficient mobile storage device, or a durable and reliable home audio-visual center, we can provide a rigorously verified, high-performance master control + NAND integrated solution.
Siemens SX4 High-speed Placement Machine + Siemens X3 Multi-function Placement Machine with Placement Solution
Achieve high-speed placement and multi-function placement, and meet the requirements of high-complexity component placement and production speed.
Placement speed: Theoretical peak 135,000 cph
Placement accuracy: ±22 μm/3σ (TwinStar placement head), angle deviation ±0.05°/3σ
We use several fully automated production lines to provide a daily production capacity of up to 35,000 SSDs (taking 256GB SSD as an example). The SMT production line is equipped with advanced Siemens SX4 high-speed placement machine, X3 multi-function placement machine, fully automatic visual printer, SPI (fully automatic solder paste optical detector), AOI (Automated Optical Inspection), and HELLER reflow oven.We use several fully automated production lines to provide a daily production capacity of up to 35,000 SSDs (taking 256GB SSD as an example). The SMT production line is equipped with advanced Siemens SX4 high-speed placement machine, X3 multi-function placement machine, fully automatic visual printer, SPI (fully automatic solder paste optical detector), AOI (Automated Optical Inspection), and HELLER reflow oven.
Our OEM/ODM service customization for you will go through
Circulation Board Loading Machine and Fully Automatic Visual Printer:
High speed, continuous board supply, low board collision failure rate, stable and continuous accommodating up to 500 PCB boards.
Printing accuracy reaches ±0.025mm
Maximum printing speed can reach 16 seconds/large board
Fully Automatic Solder Paste Optical Detector and AOI Fully Automatic Optical Detector:
1.Height measurement accuracy ≤±3μm 2.Detection speed: 70cm²/sec (standard mode) 3.Software programming time <10 minutes (automatic programming) 4. With 3D+2D + side camera synchronous detection
Detection Speed and Detection Accuracy
up to 200mm²/second, support dual-track parallel detection (dual-track mode increases production capacity by 30%)
±15μm (3σ) Height measurement accuracy ±5μm
Control the quality of each process
We mainly make production plans based on customers' requirements for product packaging, labels, shells, LOGO, etc., and then select materials, plans and process designs. After the customer confirms, we make samples and make appropriate adjustments to the samples before we can start mass production.
We are committed to providing quality products and satisfactory service, BESTOSS strictly follows the ISO 9001 production process, and all products have passed CE, FCC, RoHS, and other international authoritative certifications. Strict testing and inspection of each product before delivery to ensure that clients are 100% assured and satisfied with our products and services.
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