Bestoss DDR Manufacter: High-Precision Solder Paste Printing

Bestoss DDR Manufacturing: High-Precision Solder Paste Printing

In Bestoss's high-speed automated production facility, a PCB, soon to become a high-performance DDR memory module, begins its first step in precision manufacturing. For Bestoss, a dedicated manufacturer with 18 years of experience in the memory industry, every micron-level detail determines the performance and reliability of the final product. Therefore, we delve into Bestoss' production line, uncovering the core process—solder paste printing—and exploring how this technology provides stable and reliable memory products to customers worldwide.

High-Precision PCB Alignment
When a smooth DDR PCB substrate is fed into Bestoss' advanced solder paste printer via a precision conveyor system, it is ready to begin the first printing process. At this point, the PCB is covered in tiny solder pads, which will serve as the final electrical and mechanical connections between the memory chips and other components. To ensure complete accuracy, the printer's built-in high-resolution vision system uses multiple positioning cameras to rapidly scan and compare fiducial marks on the PCB. This system accurately compensates for minor misalignments during PCB transport, ensuring perfect alignment between the apertures in the subsequent laser stencil and the pads on the PCB. Alignment accuracy must be maintained within ±0.025mm, an absolute prerequisite for precise printing. Any slight misalignment can lead to subsequent bridging or solder joint problems.

Precise Squeegee Printing: A Balance of Force and Speed
After alignment, the stainless steel laser stencil adheres tightly to the PCB surface, forming a sealed printing surface. Next, the critical step, led by the metal squeegee, begins. In Bestoss's process, the squeegee's angle, downward pressure, and travel speed are all parameterized through years of production experience.
Typically, the squeegee pushes the viscous solder paste across the stencil's surface with a constant pressure (typically between 5-8 kg) and speed (usually between 20-80 mm/s). This motion evenly fills each precision-drilled laser-punched aperture on the stencil with solder paste. The solder paste's viscosity, metal content, and ambient temperature and humidity are strictly monitored to ensure consistent and stable filling behavior. After the squeegee completes one stroke, nearly all openings are completely filled with solder paste, and any excess is scraped off the stencil surface.

Stencil Separation: Achieving Perfect Solder Paste Formation
After the squeegee is complete, the stencil is fully filled with solder paste, but it must be separated from the PCB at a controlled speed and angle. This separation process isn't a simple vertical lift; instead, it utilizes a slight tilt angle or a specific release speed. This utilizes the principle that the adhesion between the stencil and the solder paste is weaker than that between the solder paste and the PCB pad. This ensures that the solder paste remains perfectly on the pad, forming solder dots of highly consistent size, volume, and shape.

Controlling the separation speed is crucial. Too fast a speed can cause solder paste to be pulled up, forming peaks or distorted, while too slow a speed can affect production efficiency or even cause smearing. A stable and rapid separation process is crucial for ensuring stable solder paste formation and laying a solid foundation for subsequent chip placement.

SPI Full Inspection
Even in the most sophisticated automated processes, tiny defects imperceptible to the human eye can still exist. Therefore, Bestoss has implemented a fully automated 3D solder paste inspection system (SPI) for 100% inspection between solder paste printing and component placement. This high-precision equipment uses laser or raster projection to scan each freshly printed PCB at high speed, instantly reconstructing a 3D model of every solder paste dot.
The system precisely measures the solder paste thickness, area, and volume at each solder joint and compares them to preset perfect process parameters. It can keenly detect potential defects such as insufficient solder, solder paste bridging, solder paste slump, and misalignment. Bestoss's quality control standards require that any out-of-tolerance boards detected are immediately and automatically marked and removed from the production line for cleaning and reprinting. This ensures that every PCB entering the next process is in perfect "ready-to-mount" condition, fundamentally eliminating product failures caused by poor printing.

Eighteen years of dedication, forging reliable performance
Solder paste printing, while seemingly a simple, repetitive step, is actually the most critical and first step in the entire DDR memory module SMT production process. Its precision directly determines whether hundreds of tiny components can be accurately soldered in the correct locations, creating stable and reliable electrical connections. Leveraging our 18 years of experience and expertise in memory manufacturing, Bestoss' DDR memory modules boast exceptional compatibility, stability, and longevity, ensuring they withstand the test of market demand and time.
For more information on Bestoss' products and technologies, please visit our official website at  https://www.ution-best.com/ to discover more about the secrets of high-performance SSD and DDR manufacturing.