The Boundaries of Storage: 1PB SSD Technology Evolution and Practice
As the amount of global data surges at an average annual rate of 26% (IDC 2024 report), storage technology is facing unprecedented pressure for innovation. As a manufacturer that has been deeply involved in the storage industry for more than ten years, Bestoss continues to focus on the value of SSD capacity breakthroughs in the reconstruction of the industry ecosystem. The 1PB SSD technology that has been hotly discussed in the industry recently has entered the engineering verification stage from theoretical discussion, which marks the coming of a storage density revolution.
Technical Breakthrough: from 3D NAND Stacking to Quantum Tunneling Effect
The core of achieving 1PB capacity lies in the exponential increase in storage unit density. The current leading manufacturers have achieved a single chip capacity of more than 1Tb through 3D NAND stacking with more than 192 layers and wafer bonding technology. Laboratory data shows that the test chip using the new ferroelectric tunnel junction (FTJ) architecture has a 40% increase in density compared to traditional floating gate transistors under the same process. However, challenges still exist: when the cell pitch is reduced to 10nm level, the charge leakage problem caused by quantum tunneling effect needs to be solved by upgrading the error correction code (LDPC) algorithm and the atomic layer deposition (ALD) packaging process.
In-Depth Analysis of Enterprise-Level Application Scenarios
In the field of medical image storage, a single PET-CT generates more than 2TB of data per day, and traditional storage arrays need to occupy 6U cabinet space. If 1PB SSD is used, only 2 2.5-inch disk slots are required for the same capacity, and power consumption is reduced by 67% (measured data from the IEEE Storage Summit). Bestoss is working with a tertiary hospital to develop an intelligent hierarchical storage solution to compress the response time of thermal data to microseconds, helping to improve the efficiency of AI-assisted diagnosis.
Cost Curve and Industry Transformation Timetable
According to the latest forecast by TrendForce, the commercialization process of 1PB SSD depends on three major factors:
1. The progress of wafer fabs' transition to CuA (hybrid bonding) process
2. The yield rate of quadruple-level storage cells (QLC) exceeds the critical point of 85%
3. The maturity of the enterprise-level PCIe 6.0 ecosystem
Challenges of New Paradigms in Storage Security
Ultra-high-density storage brings new risks. A single disk of 1PB means that the risk of physical theft increases exponentially. Bestoss Security Lab proposes a "three-in-one" protection strategy:
• Hardware-level AES-256+XTS mode real-time encryption
• Physical unclonable key based on PUF
• Anti-disassembly architecture of self-destructive chips
The solution has passed CC EAL 6+ certification to ensure data security in extreme scenarios.
Industry Collaborative Innovation Path
Facing the paradigm shift in storage technology, we are building an open R&D alliance:
• Co-building the "Storage Materials Joint Laboratory" with the Institute of Microelectronics of the Chinese Academy of Sciences
• Participating in the formulation of the JEDEC UCSSD 3.0 standard
• Deploying a fully automatic aging test line at the Dongguan production base
"Real technological breakthroughs require industry chain collaboration. We are willing to open basic patents and jointly promote the democratization of storage technology."
Language
